HY204 10g High-Performance Thermal Putty for GPU, VGA, IC & Processor

HY204 10g High-Performance Thermal Putty for GPU, VGA, IC & Processor

HY204 10g High-Performance Thermal Putty for GPU, VGA, IC & Processor is a high-plasticity thermal interface material designed to improve heat transfer between electronic components and heatsinks. Its flexible putty-like consistency makes it suitable for filling uneven gaps and replacing conventional thermal pads in applications such as GPU, VGA, IC, processor, and smartphone cooling.

Key Features
High-Plasticity Thermal Putty: Flexible consistency helps fill uneven gaps between components and heatsinks.
4.0W/m-K Thermal Conductivity: Provides efficient heat transfer for electronic cooling applications.
Gap-Filling Design: Suitable for areas where traditional thermal pads may not provide an ideal fit.
Wide Application: Suitable for GPU, VGA, IC, processors, smartphones, and other electronic components.
High Temperature Stability: Designed for operating temperatures from -20°C to 150°C.
Pink Thermal Putty: Easy to identify and apply during repair and maintenance work.
10g Quantity: Convenient amount for multiple repair and thermal management applications.

Specifications
Product Type: Thermal Putty
Series: HY204
Color: Pink
Net Weight: 10g
Thermal Conductivity: 4.0W/m-K
Concentration: 200# 1/10mm
Thermal Impedance: <0.028°C-in²/W
Working Temperature: -20°C to 150°C
Specific Gravity: >3.05g/cm³
Package Includes
1 × HY204 Thermal Putty (10g)